Sheridan department of physics and astronomy, the university of iowa, iowa city iowa 52242 received 4 september 1990. In hipims, high power pulses with a length of 100 s are applied to a conventional planar magnetron. A planar magnetron sputtering apparatus according to claim 1, wherein said closed contour is rotated eccentrically around the center axis. The design and performance of planar magnetron sputtering cathodes. Magnetron sputtering is a deposition technology involving a gaseous plasma which is generated and confined to a space containing the material to be deposited the target. In the present paper, the origin of particles during. Additions can include magnetron guns, a thermal resistance source or electron beam evaporation. Studying target erosion in planar sputtering magnetrons. Preferential orientations, grain sizes and lattice constants of these films vary with the substrate temperatures and gas pressures. Check that your browser and pdf plugins are uptodate. Planar magnetron sputtering download hummer sputtering systems overview pdf.
A planar magnetron sputtering apparatus is provided with an additional, variable magnetic field normal to and substantially throughout the erosion region of a cathode plate. Sputter deposition is a physical vapor deposition pvd method of thin film deposition by sputtering. The main line of development of magnetron sputtering up to the present time has been associated with the transition to planar magnetron sputtering systems in the 70s of the past century. Renewable energy, materials research, microelectronics, cv dot matrix, medical devices, sem sample preparation, the term sputtering refers to the process of dislodging atoms from a target material high purity metal or dielectric to deposit a thin film onto a material of interest. Nov 27, 2001 a planar magnetron including a surface for mounting a planar substantially polygonal target having a substantially central target area for sputtering onto a substrate, the magnetron comprising.
The magnetron sputtering system is completely customizable. The influence of the magnetic field strength and distribution on the operating characteristics of a planar magnetron has been investigated with permanent and electromagnet units. In 1974 chapins invented magnetron to improve the sputtering process 1. The use of magnetron sputtering in coating technology was first proposed by f. Uniformity as with planar magnetron cathodes, the ideal magnetic field. The present invention relates to an improved planar magnetron with a magnet assembly suitable for sputtering or reactive sputtering of materials from a cathode target onto a substrate as well as a method of operating the magnetron. The deposition of coatings on to polymer substrates by.
Pdf optical properties of cdo films prepared by dc. C magnetron sputtering is one of the admired methods for thin film deposition. Fe 2 o 3, cfo on mgo001 substrates by conventional planar magnetron sputtering. Photography reveals qualitative information on excitation, ionization, and the transport of plasma to the. The simulation methods were classified according to the type, dimension and self. An explanation for rotary magnetron end sputtering non. German, university of iowa abstract a ferromagnetic shim was placed between the target and the magnets of a planar magnetron sputtering target assembly to shunt the magnetic field. Aug 25, 2014 pdf 975 k pdf plus 319 k citing articles. Studying target erosion in planar sputtering magnetrons using. Ferroelectric films of lead zirconate titanate pzt have been fabricated by rf planar magnetron sputtering. Pm sputtering is characterized by cathode potentials of 300700 v and sputtering gas pressures of 1. Cohen plasma physics laboratory, princeton university, p. Geometrical aspects of a hollowcathode planar magnetron. The planar magnetron is a typical diode mode sputtering cathode consisting of a permanent magnet array behind it.
Between the two pole pieces is a gap within which the magnetic field and electric field produce an electron trap. Us3956093a planar magnetron sputtering method and apparatus. Influence of magnetic field on plasma parameters and thin. Theoretical results are given for a commercial planar magnetron and these are supported by experiment. May 14, 20 the planar magnetron is a typical diode mode sputtering cathode consisting of a permanent magnet array behind it.
A new generation of magnetron sputtering design and technology 29 including the pmsds planar magnetron sputtering devices proposed by us in this article. Us5242566a planar magnetron sputtering source enabling a. The sputtered nio layer exhibits enhanced crystallization, high transmittance, and uniform surface morphology as well. New rotary magnetron magnet bar improves target utilization. Film thickness distribution in magnetron sputtering. It is used to find analytic expressions for the magnetic stream function and the magnetic field for the standard rectangular magnetron geometry. Therefore, it is important to reduce the particle contamination during the manufacturing process. Multilayer graphene synthesized using magnetron sputtering for planar supercapacitor application. Multilayer graphene synthesized using magnetron sputtering.
Planar magnetron builder planar magnetron builder planar. Magnetron sputtering overview angstrom engineering. Related content superconducting bapb 1 x bi x o 3 thin films by rf magnetron sputtering minoru suzuki and toshiaki murakamihighenergy neutral atoms in the sputtering of zno. A typical dc planar magnetron sputtering discharge operates at a pres sure of 1. A typical dc planar magnetron sputtering discharge operates at a pressure of 1 10 mtorr with a magnetic. Accordingly the higher sputtering rate is achievable where the magnetic field lines are tangent to the surface, as well as perpendicular to the electric field. Magnetron sputtering system torr internationalservices llc. Unlike a 90degreeoff sputtering technique, the stray magnetic.
Planar magnetron sputtering apparatus and its magnetic. Sputtered atoms ejected from the target have a wide. Fundamentals of high power impulse magnetron sputtering. Particles generated during reactive magnetron sputtering cause defects in optical thin films, which may lead to losses in optical performance, pinholes, loss of adhesion, decreased laserinduced damage thresholds and many more negative effects. Titan planar magnetron 1inch sputter source pvd products offers a full line of planar magnetron sputter sources for your specific sputter deposition requirements. Ch3nh3pbi3based planar solar cells with magnetronsputtered. Herein we report an investigation of a ch3nh3pbi3 planar solar cell, showing significant power conversion efficiency pce improvement from 4. Planar magnetron with moving magnet assembly sinvaco n. Magnetic field dependence of sputtering magnetron efficiency. Sussex, uk of crucial importance to the thin film process engineer is an understanding of the parameters which affect the film.
Hcpm, built by surrounding a planar sputteringmagnetron. A planar magnetron sputtering source having a pair of pole pieces configured to produce a uniform coating, excellent step coverage and excellent step coverage uniformity of a wafer. Geometrical aspects of a hollowcathode planar magnetron zhehui wang a and samuel a. Magnetic field dependence of sputtering magnetron efficiency j. Fabrication of batio3 films by rf planarmagnetron sputtering. This magnet array is organized in such a fashion to provide a magnetic field that is normal to the electric field in a closed path and to create a boundary tunnel that traps electrons in the vicinity of the target surface. Submitted in partial ful llment of the requirements for the award of doctor of philosophy of loughborough universit. Different configurations of magnetrons like planar, cylindrical and sputtering gun designs have been used 5. The sputtered nio layer exhibits enhanced crystallization, high transmittance, and uniform. General behaviour of sputter magnetrons as a function of magnetic field is discussed. Planar magnetron sputteringsource design and operation.
The films were used in fabrication of supercapacitors with a planar geometry. Plasma parameters in a planar dc magnetron sputtering. Request pdf planar magnetron sputteringsource design and operation this chapter explores the aspects of the design and building of the magnetron sputter sources to understand how the source. Electron energy distribution functions eedf in dc magnetron sputtering discharge are generally found to be either maxwellian like or. A model for designing planar magnetron cathodes manuel garcia 30 may 1997 lawrence livermore national lab. The electromagnetron will give variable magnetic fields of 0. Rheed oscillations in spinel ferrite epitaxial films grown by. However, in most planar magnetron sputtering systems, there are multiple cathodes in fairly close proximity to each other, and you do not want stray north south fields formed in between the targets. Batio 3 films have been fabricated onto platinum and fusedquartz substrates by rf planarmagnetron sputtering using batio 3 ceramic target. This involves ejecting material from a target that is a source onto a substrate such as a silicon wafer. Resputtering is reemission of the deposited material during the deposition process by ion or atom bombardment. Pdf optical properties of cdo films prepared by dc planar.
Gencoa have a wellestablished track record of providing rectangular planar magnetrons and technology for coating of flexible substrates, architectural glass, solar cells, displays, touch screens and semiconductor wafers. In summary, we tested realtime in situ rheed observation of the film growth processes of fe 3 o 4. The erosion groove effects on rf planar magnetron sputtering. Abstract cdo films have been produced on glass substrates by dc planar magnetron sputtering technique in ar and o2 gases 1. Apr, 20 the planar magnetron is, in essence, a classic diode mode sputtering cathode with the addition of a permanent magnet array behind the cathode. Ion energy distributions in azo magnetron sputtering from planar and rotatable magnetrons. This study reports the direct preparation of graphenebased films using magnetron sputtering of graphite target. Progress in discharge plasma simulation of planar dc. Introduction within planar sputtering magnetrons magnetically enhanced direct current dc gas discharges are used to form thin film depositions on various types of substrates 1. These magnetron sources are based on a field proven designproviding ease of use in a small volume with excellent target utilization and deposited film uniformity. Request pdf planar magnetron sputteringsource design and operation this chapter explores the aspects of the design and building of the magnetron sputter sources to. Multilayer graphene synthesized using magnetron sputtering for planar supercapacitor application mihnea ioan ionescu, xueliang sun, and ben luan abstract. Shandrikov et althis content was downloaded from ip address 207.
A planar magnetron sputtering apparatus utilizing a plasma formed by an electromagnetic field, said apparatus comprising. High power impulse magnetron sputtering hipims is a relatively newly developed technique, which relies on the creation of a dense plasma in front of the sputtering target to produce a large fraction of ions of the sputtered material. Application of the foregoing variable magnetic field effects continuous variations in the general location of the points at which magnetic lines of flux are parallel to the cathode plate which correspondingly. Magnetron sputtering system torr internationalservices. Application of the foregoing variable magnetic field effects continuous variations in the general location of the points at which magnetic lines of flux are parallel to the cathode plate which correspondingly results in. The shape of the gap produces a depth of sputter profile in the target that results. Without magnetron, the system was limited to low ionization, low. The design and performance of planar magnetron sputtering. The simulation methods were classified according to. Planar magnetron sputtering apparatus and its magnetic source. Studying target erosion in planar sputtering magnetrons using a discrete model for energetic electrons c. The electromagnetron will give variable magnetic fields of 030 mt at the centre of the race track.
Despite the great advances in the design and study of the design of magnetron sputtering devices and magnetron sputtering technology, it cannot be said. The surface of the target is eroded by highenergy ions within the plasma, and the liberated atoms travel through the vacuum environment and deposit onto a substrate. Shukladeposition of cufilms by a planar magnetron sputtering system at ultralow operating pressure m. Deposition rates are proportional to power density, which in turn is primarily limited by the thermal conductivity and cooling efficiency of the target. The chamber can be designed to accept additional evaporation sources, and unused ports are blocked off with flanges to allow future additions.
Note that the pvd magnetron works with either magnetic alignment the center can be north and the perimeter can be south, or vice versa. Renewable energy, materials research, microelectronics, cv dot matrix, medical devices, sem sample preparation. Osa origin of particles during reactive sputtering of. Highvacuum planar magnetron sputtering to cite this article. A simple low cost method for increased performance of planar magnetron sputtering targets j.
Reactivesputtered prepared tin oxide thin film as an. We observed sharp streaks and clear kikuchi lines in the rheed pattern measured with a differential pumping system during the sputtering processes. All the depositions were performed using an unbalanced d. It is observed from optical properties that the films. In addition, reactive magnetron sputtering can prepare a compound. The deposition of coatings on to polymer substrates by planar. Pdf ion energy distributions in azo magnetron sputtering.
Penning 1 in 1935 and patented in several countries. This magnet array is arranged so that the magnetic field is normal to the electric field in a closed path and forms a boundary tunnel which traps electrons near the surface of the target. Although conventional planartype magnetron sputtering is widely employed in industries as well as in laboratories, in situ rheed experiments have not been carried out to our knowledge. The shape of the gap produces a depth of sputter profile in the target that results in the uniform.
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